Programa del congreso

Este trabajo presenta la caracterización de la conductividad efectiva de los materiales de fabricación aditiva utilizados para la manufactura de dispositivos para comunicaciones de alta frecuencia. Tanto el tipo de material, la porosidad, la rugosidad, como la oxidación disminuyen el valor de dicha conductividad llevando a un incremento en las pérdidas de inserción de los dispositivos fabricados. Para la caracterización se ha diseñado un resonador de cavidad en banda X sobre guía de onda rectangular y se ha medido el factor de calidad de diferentes realizaciones con técnicas y materiales diversos. Se han obtenido valores de hasta 17.70 $MS/m$ para materiales poliméricos metalizados y de hasta 5.32 $MS/m$ para aleaciones metálicas.

Empty Substrate Integrated Waveguides (ESIW)

integrate hollow 3D waveguides into printed circuit boards

(PCBs), thereby creating an empty waveguide with reduced

height while maintaining low cost, low profile, and easy in-

tegration. Several transitions have been proposed to connect

ESIW circuits to microstrip lines. However, these transitions

generally increase the complexity of the manufacturing process

and cannot be directly connected to measurement equipment.

Therefore, in this communication, a direct coaxial-to-ESIW

transition based on magnetic coupling is proposed. This structure

can be manufactured with reduced complexity, requiring only

simple cuts and metalization. An equivalent circuit model has

been proposed, which provides initial values for the transmission

parameters, and reduces the optimization time by 20%.

This article presents the design and manufacturing

of a fully metallic X-band bandpass filter in coaxial-line tech-

nology. The device is 3D-printed as a self-supported structure

without any dielectric inside. A short-circuit λ/4 parallel stub

bandpass filter an electrical connection between the inner and

outer coaxial-line conductors, and provide the required me-

chanical support for the self-supported 3D-printing process. To

enhance filter out-of-band performance, a second stage consisting

of a stepped-impedance low-pass filter is integrated, also using

coaxial-line technology. Both filters are designed separately and

then combined to achieve desired frequency specifications. A

prototype with a passband at X-band (between 8 and 12 GHz)

is manufactured using Selective Laser Melting, showing exce-

llent agreement between simulations and measurements. This

approach promises highly integrated, multifunctional monoblock

coaxial filters with additional benefits such as increased RF

shielding and protection against electrostatic discharge.

El efecto multipactor plantea un reto importante en los dispositivos de RF y microondas de alta potencia, como los filtros combline, ya que afecta a la integridad de la señal y al rendimiento del dispositivo. En este artículo, proponemos emplear un perfil de superficie corrugado para mitigar este efecto. Mediante simulaciones numéricas, demostramos que la introducción de una superficie corrugada suprime significativamente la aparición y propagación de descargas multipactor dentro de la estructura del filtro. El perfil corrugado altera eficazmente las condiciones propicias para la formación de avalanchas de electrones, aumentando así el nivel umbral de ruptura y reduciendo la probabilidad de degradación de la señal inducida por el multipactor. Además, exploramos la influencia de diversos parámetros geométricos del perfil corrugado en la supresión del efecto multipactor, proporcionando información sobre las consideraciones de diseño óptimas para mitigar este fenómeno. Nuestros hallazgos no sólo ofrecen una valiosa guía para el desarrollo de filtros combline robustos y fiables, sino que también contribuyen a una comprensión más amplia de las técnicas de supresión de multipactor en aplicaciones de RF y microondas de alta potencia.

In this work, the practical design of a Ka-band

diplexer and triplexer in half-mode groove gap waveguide (HMGGW)

technology is proposed. The first device is composed of

two bandpass HM-GGW filters, an E-plane T-junction and the

corresponding transitions to the input/output WR28 rectangular

waveguide ports. The second one has a manifold herringbone

configuration where three bandpass HM-GGW filters are directly

coupled on the common short line without the use of stubs.

In order to demonstrate the applicability of this technology, a

diplexer prototype has been successfully fabricated, showing inband

measured return and insertion losses of 21 dB and 0.87 dB

in the lower band, 16 dB and 0.86 dB in the upper band, and a

good isolation level (better than 32.5 dB) in the whole operational

frequency range. This good electrical behaviour demonstrates

that HM-GGW is an attractive technology for the design of high

frequency components, thus helping to reduce its size respect to

the equivalent component in the classical GGW technology.

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